JPH075643Y2 - 半導体スタック - Google Patents
半導体スタックInfo
- Publication number
- JPH075643Y2 JPH075643Y2 JP971788U JP971788U JPH075643Y2 JP H075643 Y2 JPH075643 Y2 JP H075643Y2 JP 971788 U JP971788 U JP 971788U JP 971788 U JP971788 U JP 971788U JP H075643 Y2 JPH075643 Y2 JP H075643Y2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- laminated body
- pressurizing
- disc spring
- stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 238000010030 laminating Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 description 14
- 239000004020 conductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Fuel Cell (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP971788U JPH075643Y2 (ja) | 1988-01-29 | 1988-01-29 | 半導体スタック |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP971788U JPH075643Y2 (ja) | 1988-01-29 | 1988-01-29 | 半導体スタック |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01115256U JPH01115256U (en]) | 1989-08-03 |
| JPH075643Y2 true JPH075643Y2 (ja) | 1995-02-08 |
Family
ID=31216706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP971788U Expired - Lifetime JPH075643Y2 (ja) | 1988-01-29 | 1988-01-29 | 半導体スタック |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075643Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088007A (ja) * | 2005-09-20 | 2007-04-05 | Toshiba Mitsubishi-Electric Industrial System Corp | 半導体スタック |
| JP6108026B1 (ja) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | 圧接型半導体モジュール |
-
1988
- 1988-01-29 JP JP971788U patent/JPH075643Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01115256U (en]) | 1989-08-03 |
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